Invention Grant
- Patent Title: Coil component and method of manufacturing the same
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Application No.: US15970192Application Date: 2018-05-03
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Publication No.: US11037722B2Publication Date: 2021-06-15
- Inventor: Ji Hyung Jung , Boum Seock Kim , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0121212 20170920
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F41/00 ; H01F27/29 ; H01F41/04 ; H01F41/10 ; H01F17/04 ; H01F27/28

Abstract:
A coil component includes: a body portion; a coil portion; and an electrode portion, wherein the coil portion includes: a support member; a first coil layer disposed on a first surface of the support member, having first conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a second coil layer disposed on a second surface of the support member, having second conductive patterns having a planar coil shape, and having a constant line width up to an innermost end portion; a via hole penetrating through the support member and partially overlapping innermost end portions of the first and second conductive patterns; and a via conductor filling a portion of the via hole and connected to the innermost end portions of the first and second conductive patterns.
Public/Granted literature
- US20190088407A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-03-21
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |