Invention Grant
- Patent Title: Electronic component having metal frames with insulating layers thereon
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Application No.: US16200373Application Date: 2018-11-26
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Publication No.: US11037730B2Publication Date: 2021-06-15
- Inventor: Ho Yoon Kim , Woo Chul Shin , Sang Soo Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0119607 20181008
- Main IPC: H01G4/224
- IPC: H01G4/224 ; H01G4/232 ; H01G4/248 ; H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G4/008

Abstract:
An electronic component includes a body; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second metal frames connected to the first and second external electrodes, respectively, wherein the first and second metal frames include first and second support portions bonded to the first and second connection portions, and first and second mounting portions extended in the first direction from lower ends of the first and second support portions and spaced apart from the body and the first and second external electrodes, and further include first and second insulating layers formed on external surfaces of the first and second support portions.
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