Invention Grant
- Patent Title: Substrate support apparatus and plasma processing apparatus having the same
-
Application No.: US16268790Application Date: 2019-02-06
-
Publication No.: US11037766B2Publication Date: 2021-06-15
- Inventor: Kwang-Nam Kim , Sung-Yeon Kim , Hyung-Jun Kim , Jong-Woo Sun , Sang-Rok Oh , Jung-Pyo Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2018-0085195 20180723
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683 ; H01L21/67

Abstract:
A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.
Public/Granted literature
- US20200027705A1 SUBSTRATE SUPPORT APPARATUS AND PLASMA PROCESSING APPARATUS HAVING THE SAME Public/Granted day:2020-01-23
Information query