Invention Grant
- Patent Title: Methods and apparatus for cleaning substrates
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Application No.: US16334923Application Date: 2016-09-20
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Publication No.: US11037804B2Publication Date: 2021-06-15
- Inventor: Hui Wang , Xi Wang , Fuping Chen , Fufa Chen , Jian Wang , Xiaoyan Zhang , Yinuo Jin , Zhaowei Jia , Jun Wang , Xuejun Li
- Applicant: ACM Research (Shanghai) Inc.
- Applicant Address: CN Shanghai
- Assignee: ACM Research (Shanghai) Inc.
- Current Assignee: ACM Research (Shanghai) Inc.
- Current Assignee Address: CN Shanghai
- Agency: K&L Gates LLP
- International Application: PCT/CN2016/099428 WO 20160920
- International Announcement: WO2018/053678 WO 20180329
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/68 ; H01L21/687
Abstract:
The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
Public/Granted literature
- US20190287824A1 METHODS AND APPARATUS FOR CLEANING SUBSTRATES Public/Granted day:2019-09-19
Information query
IPC分类:
