Invention Grant
- Patent Title: Wafer processing method using a ring frame with a polyester sheet with no adhesive layer
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Application No.: US16704369Application Date: 2019-12-05
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Publication No.: US11037814B2Publication Date: 2021-06-15
- Inventor: Shigenori Harada , Minoru Matsuzawa , Hayato Kiuchi , Yoshiaki Yodo , Taro Arakawa , Masamitsu Agari , Emiko Kawamura , Yusuke Fujii , Toshiki Miyai , Makiko Ohmae
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JPJP2018-229358 20181206
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L23/544 ; H01L21/78 ; H01L21/268 ; C09J7/35 ; C09J5/06 ; C09J7/10
Abstract:
A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet in each region of the polyester sheet corresponding to each device chip, pushing up each device chip from the polyester sheet side to pick up each device chip from the polyester sheet.
Public/Granted literature
- US20200185253A1 WAFER PROCESSING METHOD Public/Granted day:2020-06-11
Information query
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