- Patent Title: Apparatus with multi-wafer based device and method for forming such
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Application No.: US16475084Application Date: 2017-03-30
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Publication No.: US11037817B2Publication Date: 2021-06-15
- Inventor: Anup Pancholi , Prashant Majhi , Paul Fischer , Patrick Morrow
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP
- International Application: PCT/US2017/025178 WO 20170330
- International Announcement: WO2018/182648 WO 20181004
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L23/522 ; H01L23/00
Abstract:
An apparatus is provided which comprises: a substrate; one or more active devices adjacent to the substrate; a first set of one or more layers to interconnect the one or more active devices; a second set of one or more layers; and a layer adjacent to one of the layers of the first and second sets, wherein the layer is to bond the one of the layers of the first and second sets.
Public/Granted literature
- US20190333803A1 APPARATUS WITH MULTI-WAFER BASED DEVICE AND METHOD FOR FORMING SUCH Public/Granted day:2019-10-31
Information query
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