Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16593640Application Date: 2019-10-04
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Publication No.: US11037845B2Publication Date: 2021-06-15
- Inventor: Hiroyuki Masumoto
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2019-040646 20190306
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/31 ; H01L23/10 ; H01L23/00
Abstract:
A semiconductor device includes: a semiconductor chip; a case storing the semiconductor chip; a wire bonded to the semiconductor chip; a cover fixed inside the case and including a concave portion disposed above the semiconductor chip and the wire; and a sealing resin potted inside the case and sealing the semiconductor chip, the wire and the cover, wherein the sealing resin is not filled in the concave portion so that a cavity is provided.
Public/Granted literature
- US20200286799A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-09-10
Information query
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