Invention Grant
- Patent Title: Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus
-
Application No.: US16467582Application Date: 2016-12-30
-
Publication No.: US11037855B2Publication Date: 2021-06-15
- Inventor: Sonja Koller , Reinhard Mahnkopf
- Applicant: Intel IP Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel IP Corporation
- Current Assignee: Intel IP Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2016/069481 WO 20161230
- International Announcement: WO2018/125208 WO 20180705
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/367 ; H01L23/10
Abstract:
A system-in-package apparatus includes a contoured heat sink that provides a first recess and a subsequent recess. The system-in-package apparatus includes a flexible printed wiring board that is wrapped onto the contoured heat sink after a manner to enclose the first semiconductive device into the first recess and a semiconductive device in the subsequent recess.
Public/Granted literature
- US20200043826A1 CONTOURED-ON-HEAT-SINK, WRAPPED PRINTED WIRING BOARDS FOR SYSTEM-IN-PACKAGE APPARATUS Public/Granted day:2020-02-06
Information query
IPC分类:
