Invention Grant
- Patent Title: Semiconductor module, method for manufacturing the same, and power conversion device
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Application No.: US16454470Application Date: 2019-06-27
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Publication No.: US11037858B2Publication Date: 2021-06-15
- Inventor: Yoshitaka Kimura
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2018-243116 20181226
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H02M7/5387 ; H01L21/54 ; H01L21/52 ; H01L21/56
Abstract:
A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.
Public/Granted literature
- US20200211921A1 SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE Public/Granted day:2020-07-02
Information query
IPC分类:
