Invention Grant
- Patent Title: Semiconductor module
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Application No.: US16610947Application Date: 2018-04-25
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Publication No.: US11037867B2Publication Date: 2021-06-15
- Inventor: Thomas Proepper
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Priority: DE102017207564.3 20170505
- International Application: PCT/EP2018/060603 WO 20180425
- International Announcement: WO2018/202509 WO 20181108
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/051

Abstract:
A semiconductor module has at least two semiconductor components which are arranged within a housing in each case between two electrical conduction elements and are electrically conductively connected to the electrical conduction elements. The electrical conduction elements respectively have a contact extension that is led out of the housing, wherein two contact extensions arranged in different planes are connected to one another outside the housing via a contact element, which forms a current path between the two contact extensions outside the housing.
Public/Granted literature
- US20200058575A1 SEMICONDUCTOR MODULE Public/Granted day:2020-02-20
Information query
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