Invention Grant
- Patent Title: Electronic module, lead frame and manufacturing method for electronic module
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Application No.: US16070267Application Date: 2017-05-19
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Publication No.: US11037870B2Publication Date: 2021-06-15
- Inventor: Kosuke Ikeda , Osamu Matsuzaki
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/018826 WO 20170519
- International Announcement: WO2018/211684 WO 20181122
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/31 ; H01L23/367 ; H01L23/495 ; H01L23/00 ; H01L25/07 ; H01L25/18 ; H01L25/00

Abstract:
An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 and a second terminal part 120. The first terminal part 110 has a first terminal base end part 111, a first terminal outer part 113, and a first bending part 112 that is provided between the first terminal base end part 111 and the first terminal outer part 113 and that is bent toward the other side on a side of the first terminal base end part 111. The second terminal part 120 has a second terminal base end part 121, a second terminal outer part 123, and a second bending part 122 that is provided between the second terminal base end part 121 and the second terminal outer part 123 and that is bent toward one side on a side of the second terminal base end part 121.
Public/Granted literature
- US20210043554A1 ELECTRONIC MODULE, LEAD FRAME AND MANUFACTURING METHOD FOR ELECTRONIC MODULE Public/Granted day:2021-02-11
Information query
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