Invention Grant
- Patent Title: Light emitting device
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Application No.: US16230591Application Date: 2018-12-21
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Publication No.: US11037911B2Publication Date: 2021-06-15
- Inventor: Motokazu Yamada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Global IP Counselors, LLP
- Priority: JPJP2017-250606 20171227,JPJP2018-232286 20181212
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/46 ; H01L33/20 ; H01L33/62

Abstract:
A light emitting device includes a wiring substrate, light emitting elements, light-reflecting films, and a light diffusing member. The light emitting elements are mounted in a matrix on the wiring substrate. Each of the light emitting elements includes a sapphire substrate having a lower surface, first lateral surfaces inclined to the lower surface, and second lateral surfaces perpendicular to the lower surface, and a semiconductor layered structure disposed on the lower surface. The light-reflecting films are respectively disposed on the light emitting elements. The light diffusing member is disposed above the light emitting elements. At least a group of the light emitting elements is arranged such that, in every adjacent ones of the light emitting elements in at least one of a row direction and a column direction, the first lateral surface of the light emitting element faces the second lateral surface of the adjacent light emitting element.
Public/Granted literature
- US20190198484A1 LIGHT EMITTING DEVICE Public/Granted day:2019-06-27
Information query
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