An IC chip comprises LED devices exposed on a front side of the IC chip, I/O bumps on a back side of the IC chip, a first die forming a stack with the LED devices and comprising driver circuits electrically connected to the LED devices, a first circuit that extends along the vertical direction from the front side of the IC chip towards a back side of the IC chip and across at least a thickness of the first die to provide electrical connections between the LED devices and at least some of the I/O bumps, a second die including pipelining circuits and control circuits for the driver circuits, a second circuit that extends from the second die, and a circuit board electrically connected to the I/O bumps and to a power system.