Invention Grant
- Patent Title: Techniques for processing devices
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Application No.: US16919989Application Date: 2020-07-02
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Publication No.: US11037919B2Publication Date: 2021-06-15
- Inventor: Cyprian Emeka Uzoh , Laura Wills Mirkarimi , Guilian Gao , Gaius Gillman Fountain, Jr.
- Applicant: Invensas Bonding Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Invensas Bonding Technologies, Inc.
- Current Assignee: Invensas Bonding Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/00 ; H01L25/065 ; H01L23/00 ; H01L21/78 ; H01L21/683 ; H01L21/18
Abstract:
Representative techniques provide process steps for forming a microelectronic assembly, including preparing microelectronic components such as dies, wafers, substrates, and the like, for bonding. One or more surfaces of the microelectronic components are formed and prepared as bonding surfaces. The microelectronic components are stacked and bonded without adhesive at the prepared bonding surfaces.
Information query
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