Invention Grant
- Patent Title: Imaging element, stacked imaging element, and solid-state imaging device
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Application No.: US16499916Application Date: 2018-02-20
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Publication No.: US11037979B2Publication Date: 2021-06-15
- Inventor: Fumihiko Koga
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2017-078236 20170411
- International Application: PCT/JP2018/005955 WO 20180220
- International Announcement: WO2018/189999 WO 20181018
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An imaging element has at least a photoelectric conversion section, a first transistor TR1, and a second transistor TR2, the photoelectric conversion section includes a photoelectric conversion layer, a first electrode, and a second electrode, the imaging element further has a first photoelectric conversion layer extension section, a third electrode, and a fourth electrode, the first transistor TR1 includes the second electrode that functions as one source/drain section, the third electrode that functions as a gate section, and the first photoelectric conversion layer extension section that functions as the other source/drain section, and the first transistor TR1 (TRrst) is provided adjacent to the photoelectric conversion section.
Information query
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