Invention Grant
- Patent Title: Non-planar field effect transistor devices with low-resistance metallic gate structures
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Application No.: US16662332Application Date: 2019-10-24
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Publication No.: US11038015B2Publication Date: 2021-06-15
- Inventor: Kangguo Cheng , Chen Zhang , Wenyu Xu , Xin Miao
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Randall Bluestone
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/40 ; H01L21/02 ; H01L21/8238 ; H01L21/308 ; H01L21/28 ; H01L29/41 ; H01L29/51

Abstract:
Methods are provided to construct field-effect transistors comprising low-resistance metallic gate structures. A field-effect transistor includes a nanosheet stack and a metal gate which covers a gate region of the nanosheet stack. The nanosheet stack includes nanosheet channel layers and an etch stop layer disposed above an upper nanosheet channel layer. The metal gate includes a work function metal which encapsulates the nanosheet channel layers, and a gate electrode disposed above and in contact with the work function metal. An upper surface of the work function metal is recessed to be substantially coplanar with the etch stop layer. The gate electrode has a resistivity which is less than a resistivity of the work function metal. The etch stop layer protects the portion of the work function metal disposed between the etch stop layer and the upper nanosheet channel layer from being etched when recessing the work function metal.
Public/Granted literature
- US20200075720A1 NON-PLANAR FIELD EFFECT TRANSISTOR DEVICES WITH LOW-RESISTANCE METALLICE GATE STRUCTURES Public/Granted day:2020-03-05
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