Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
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Application No.: US16395731Application Date: 2019-04-26
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Publication No.: US11038058B2Publication Date: 2021-06-15
- Inventor: Kuo-Cheng Chiang , Shi-Ning Ju , Ching-Wei Tsai , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8238 ; H01L29/423 ; H01L29/66 ; H01L27/092

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a dielectric fin structure over the substrate. The semiconductor device structure also includes a semiconductor fin structure adjacent to the dielectric fin structure. The semiconductor device structure also includes a metal gate stack across the dielectric fin structure and the semiconductor fin structure. The semiconductor device structure also includes a source/drain feature over the semiconductor fin structure. The semiconductor device structure also includes a source/drain spacer interposed between the source/drain feature and the dielectric fin structure.
Public/Granted literature
- US20200343376A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2020-10-29
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