Light-emitting device packages include a package substrate surrounded by a lower molding member, a light-emitting device on the package substrate and surrounded by an upper molding member, a heat conductive pad between a lower surface of the light-emitting device and an upper surface of the package substrate, a first electrode on an upper surface of the light-emitting device, a second electrode on the upper surface of the light-emitting device, a fluorescent material on the upper surface of the light-emitting device, and a plurality of bonding wires electrically connecting the package substrate with separate, respective electrodes of the first electrode and the second electrode.