To obtain a vapor-deposition mask that suppresses heat conduction at a frame of the vapor-deposition mask and make the weight thereof lighter to achieve upsizing of the vapor-deposition mask and carry out high-definition vapor-deposition cheaply, the frame (15) to which a mask main body (10) is bonded is formed as a sandwich structure (150) in which end plate (152) is bonded onto an opposing surface of at least a part of a core portion (151) in the vapor-deposition mask disclosed in the present embodiment.