A film formation apparatus according to an embodiment comprising: a substrate holder for holding a substrate in a standing position relative to the horizontal plane, the substrate having a vapor deposition surface on which a vapor deposition layer is formed; and an evaporation source to supply a vapor deposition material onto the vapor deposition surface while moving relative to the substrate holder upward and/or downward, the evaporation source being disposed in a region which the vapor deposition surface of the substrate held by the substrate holder is to face. The substrate holder is configured to hold the substrate in an inclined orientation relative to the vertical plane such that the upper end of the substrate is located away from the evaporation source. The apparatus further comprises an adjustment means for reducing a variation in the thickness of the vapor deposition layer, which results from the inclination of the substrate.