Invention Grant
- Patent Title: Antenna apparatus and antenna module
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Application No.: US16176015Application Date: 2018-10-31
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Publication No.: US11038274B2Publication Date: 2021-06-15
- Inventor: Nam Ki Kim , Jeong Ki Ryoo
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0008358 20180123,KR10-2018-0054152 20180511
- Main IPC: H01Q9/28
- IPC: H01Q9/28 ; H01Q9/20 ; H01Q1/48 ; H01Q21/06 ; H01Q1/24 ; H01Q21/08 ; H01Q1/52

Abstract:
An antenna apparatus includes a ground layer, a wiring layer spaced apart from either a first surface or a second surface of the ground layer and including wiring lines, feed lines electrically connected to the wiring lines, a dipole antenna pattern to transmit and/or receive an RF signal, a plurality of feed vias to electrically connect poles of the dipole antenna pattern to the feed lines, and a ground pattern to electrically connect the poles of the dipole antenna pattern to the ground layer.
Public/Granted literature
- US20190229426A1 ANTENNA APPARATUS AND ANTENNA MODULE Public/Granted day:2019-07-25
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