Invention Grant
- Patent Title: Semiconductor layer structure with a thick buffer layer
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Application No.: US16423820Application Date: 2019-05-28
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Publication No.: US11038320B2Publication Date: 2021-06-15
- Inventor: Li Fan
- Applicant: Lumentum Operations LLC
- Applicant Address: US CA Milpitas
- Assignee: Lumentum Operations LLC
- Current Assignee: Lumentum Operations LLC
- Current Assignee Address: US CA Milpitas
- Agency: Harrity & Harrity, LLP
- Main IPC: H01S5/16
- IPC: H01S5/16 ; H01S5/34 ; H01S5/323 ; H01S5/343

Abstract:
A semiconductor layer structure may include a substrate, a buffer layer formed on the substrate, and a set of epitaxial layers formed on the buffer layer. The buffer layer may have a thickness that is greater than 2 micrometers (μm). The set of epitaxial layers may include a quantum well layer. A quantum well intermixing region may be formed in association with the quantum well layer and a material diffused from a region of a surface of the semiconductor layer structure.
Public/Granted literature
- US20200067280A1 SEMICONDUCTOR LAYER STRUCTURE WITH A THICK BUFFER LAYER Public/Granted day:2020-02-27
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