An over-voltage tolerant test bus for an integrated circuit (IC) is disclosed. The over-voltage tolerant test bus includes a first switch to be coupled to a test pin of the IC and a second switch to be coupled to an internal module of the IC. The second switch is coupled to the first switch in series. The over-voltage tolerant test bus also includes a protection circuit coupled between the first switch and the second switch and a supply voltage to keep a voltage between a source and a drain of the first switch substantially equal to a difference between a voltage at the test pin and the supply voltage.