Invention Grant
- Patent Title: Peg-based ligands with enhanced dispersibility and improved performance
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Application No.: US15998504Application Date: 2018-08-16
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Publication No.: US11041071B2Publication Date: 2021-06-22
- Inventor: Ravisubhash Tangirala , Shihai Kan , Jay Yamanaga , Charles Hotz , Donald Zehnder
- Applicant: Nanosys, Inc.
- Applicant Address: US CA Milpitas
- Assignee: Nanosys, Inc.
- Current Assignee: Nanosys, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: C08L71/02
- IPC: C08L71/02 ; C08K3/22 ; C08K3/30 ; C08K5/5313 ; C08K5/3412 ; C08K5/3467 ; C08G65/332 ; C08G65/333 ; B82Y40/00

Abstract:
The present disclosure provides nanostructure compositions and methods of producing nanostructure compositions. The nanostructure compositions comprise at least one population of nanostructures, at least one poly(alkylene oxide) ligand bound to the surface of the nanostructures, and optionally at least one organic resin. The present disclosure also provides nanostructure films comprising a nanostructure layer and methods of making nanostructure films.
Public/Granted literature
- US20190077954A1 PEG-BASED LIGANDS WITH ENHANCED DISPERSIBILITY AND IMPROVED PERFORMANCE Public/Granted day:2019-03-14
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