Invention Grant
- Patent Title: Palladium-based alloys
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Application No.: US16509136Application Date: 2019-07-11
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Publication No.: US11041228B2Publication Date: 2021-06-22
- Inventor: Arthur S. Klein , Edward F. Smith, III , Srinath Viswanathan
- Applicant: Deringer-Ney, Inc.
- Applicant Address: US CT Bloomfield
- Assignee: Deringer-Ney, Inc.
- Current Assignee: Deringer-Ney, Inc.
- Current Assignee Address: US CT Bloomfield
- Agency: Dorsey & Whitney LLP
- Main IPC: C22C5/04
- IPC: C22C5/04 ; G01R1/067

Abstract:
Palladium-based ternary or higher alloys include palladium at about 45-55 wt %, copper about 32-42 wt %, silver at about 8-15 wt %, rhenium at about 0-5 wt %, and optionally one or more modifying elements at up to 1.0 wt %. The alloys are age-hardenable, provide hardness in excess of 350 HK (Knoop, 100 g load), have electrical conductivities above 19.5% IACS (International Annealed Copper Standard), have an elevated temperature strength above 100 ksi at temperatures up to 480° F. (250° C.), and remain ductile (tensile elongation>2%) in their fully age-hardened condition. The alloys may be used in static and moveable electrical contact and probe applications.
Public/Granted literature
- US20190330713A1 Palladium-Based Alloys Public/Granted day:2019-10-31
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