Invention Grant
- Patent Title: Sensor unit, electronic apparatus, and moving body
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Application No.: US16729614Application Date: 2019-12-30
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Publication No.: US11041723B2Publication Date: 2021-06-22
- Inventor: Yusuke Kinoshita , Masayasu Sakuma
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2014-145671 20140716,JP2014-257001 20141219,JP2015-136741 20150708
- Main IPC: G01D11/24
- IPC: G01D11/24 ; G01C19/5783 ; G01P15/18 ; G01P1/02 ; G01P15/12 ; B81B7/00 ; G01P15/08 ; G01P15/125

Abstract:
A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided.
A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.
A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.
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