Invention Grant
- Patent Title: Composite sensor package
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Application No.: US16089499Application Date: 2017-03-30
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Publication No.: US11041744B2Publication Date: 2021-06-22
- Inventor: Jeong Gi Seo , Ki Chul Chang , Sun Hwa Lee , Jun Young Lim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: LRK Patent Law Firm
- Priority: KR10-2016-0039740 20160331
- International Application: PCT/KR2017/003525 WO 20170330
- International Announcement: WO2017/171455 WO 20171005
- Main IPC: G01D21/02
- IPC: G01D21/02 ; B81B3/00

Abstract:
A composite sensor package includes: a substrate; a first sensor and a second sensor, which are arranged on the substrate with a predetermined gap therebetween; a signal processing device disposed on the substrate and processing a signal transmitted through the first and second sensors; and a cover disposed on the substrate, and including a package accommodation space enclosing the first sensor, the second sensor and the signal processing device, wherein the first sensor senses a state of air introduced from an outside and transmits the introduced air to the package accommodation space, and the second sensor senses the state of the air, which passes through the first sensor so as to flow into the package accommodation space.
Public/Granted literature
- US20200300676A1 COMPOSITE SENSOR PACKAGE Public/Granted day:2020-09-24
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