A sensing device of pressure and temperature in a mold comprises: a housing communicating with a mold cavity, and including a channel and an accommodating space; a base on a bottom surface of the housing, and including a mesa on a top; a strut in the accommodating space, and a front end thereof extended into the channel and exposed to the mold cavity; a strain structure between the mesa and a back end of the strut, and located on the mesa; a strain gage on the strain structure to measure a deformation amount of the strain structure the mold cavity and transforming the deformation amount into deformation amount information; a temperature-sensing element in the strut to measure a temperature of the strut, and transforming the temperature into strut temperature information; and a processing unit to obtain the deformation amount information and the strut temperature information.