A method for measuring fracture characteristics of adhesive polymeric material comprises: (i) bonding a sample to a rigid substrate; (ii) cooling the sample from a first temperature to a second temperature such that thermally-induced stresses are generated within the sample, wherein the thermally-induced stresses generate an inward-growing three-dimensional spiral crack within the sample; (iii) detecting, by three or more AE piezoelectric sensors, mechanical transient waves generated during development of the inward-growing three-dimensional spiral crack within the sample and determining the accurate 3D geometry of the spiral using source location technique; (iv) visualizing the two-dimensional spiral cracking pattern deposited on a surface of the rigid substrate and measuring the precise width of the crack; (v) determining, using the detected mechanical waves and the visualized deposited sample, AE-based fracture characteristics of the sample; and (vi) reporting the determined one or more fracture characteristics of the sample.