Invention Grant
- Patent Title: Flexible substrate and manufacturing method of same
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Application No.: US16642025Application Date: 2019-12-24
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Publication No.: US11042092B2Publication Date: 2021-06-22
- Inventor: Feng Ding
- Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Wuhan
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Wuhan
- Priority: CN201910640984.2 20190716
- International Application: PCT/CN2019/128082 WO 20191224
- International Announcement: WO2021/008083 WO 20210121
- Main IPC: B32B3/00
- IPC: B32B3/00 ; G03F7/20 ; B32B3/10 ; B32B3/18 ; G03F7/26

Abstract:
The present application provides a flexible substrate and a manufacturing method of the flexible substrate. The flexible substrate includes a first flexible layer, a barrier layer, a second flexible layer, and a buffer layer. The barrier layer is disposed on a surface of the first flexible layer, the barrier layer includes a first bending resistant structure disposed therein, the second flexible layer is disposed on a surface of the barrier layer, the buffer layer is disposed on a surface of the second flexible layer, and the buffer layer includes a second bending resistant structure disposed therein.
Public/Granted literature
- US20210018842A1 FLEXIBLE SUBSTRATE AND MANUFACTURING METHOD OF SAME Public/Granted day:2021-01-21
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