By configuring a timepiece component to include an intermediate film provided on at least a portion of a surface of a base material formed by using a nonconductive first material as a main component and to include a buffer film stacked on the intermediate film and mainly composed of a second material having a tenacity higher than that of the first material, the timepiece component may be manufactured with high precision, the weight thereof may be reduced, and even when the base material is formed by using a brittle material such as silicon, the timepiece component becomes resistant to breakage and capable of exhibiting high strength when an impact is externally applied.