Invention Grant
- Patent Title: Hinge module and electronic device
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Application No.: US16447987Application Date: 2019-06-21
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Publication No.: US11042198B2Publication Date: 2021-06-22
- Inventor: Cheng-Shiue Jan , Wei-Hao Lan
- Applicant: Cheng-Shiue Jan , Wei-Hao Lan
- Applicant Address: TW Taipei; TW Taipei
- Assignee: Cheng-Shiue Jan,Wei-Hao Lan
- Current Assignee: Cheng-Shiue Jan,Wei-Hao Lan
- Current Assignee Address: TW Taipei; TW Taipei
- Agency: JCIPRNET
- Main IPC: E05D3/06
- IPC: E05D3/06 ; G06F1/16 ; E05D3/18 ; E05D7/00

Abstract:
A hinge module includes a base, a first shaft, a second shaft, a first bracket, a second bracket, and a linkage component. The base has a bottom plate and two guiding plates opposite to each other. The first shaft is movably and rotatably penetrates through the two guiding plates. The second shaft is movably and rotatably penetrates through the two guiding plates. The first bracket is disposed at a first end of the first shaft. The second bracket is disposed at a first end of the second shaft. The linkage component is disposed in the base and is connected to the first shaft and the second shaft. The first shaft and the second shaft linearly move along the two guiding plates through the linkage component to change a spacing distance between the first shaft and the second shaft and are configured to drive the first bracket and the second bracket to move away from each other or approach each other.
Public/Granted literature
- US20200012322A1 HINGE MODULE AND ELECTRONIC DEVICE Public/Granted day:2020-01-09
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