Invention Grant
- Patent Title: Electromagnetic relay
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Application No.: US16174872Application Date: 2018-10-30
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Publication No.: US11043347B2Publication Date: 2021-06-22
- Inventor: Takaki Sunohara , Nobuyoshi Hiraiwa
- Applicant: FUJITSU COMPONENT LIMITED
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JPJP2017-224556 20171122
- Main IPC: H01H1/00
- IPC: H01H1/00 ; H01H50/56 ; H01H50/64 ; H01H50/54 ; H01H51/29 ; H01H50/04 ; H01H50/02 ; H01H50/26 ; H01H1/26
Abstract:
An electromagnetic relay includes a fixed spring, a fixed contact configured to be swaged so as to be attached to the fixed spring, a movable spring, and a movable contact provided on the movable spring so as to be capable of making contact with the fixed contact, wherein a swaged portion of the fixed contact is formed so as not to protrude from a surface of the fixed spring.
Public/Granted literature
- US20190157030A1 ELECTROMAGNETIC RELAY Public/Granted day:2019-05-23
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