Invention Grant
- Patent Title: Plasma deposition of carbon hardmask
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Application No.: US16055974Application Date: 2018-08-06
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Publication No.: US11043375B2Publication Date: 2021-06-22
- Inventor: Yang Yang , Eswaranand Venkatasubramanian , Kartik Ramaswamy , Kenneth S. Collins , Steven Lane , Gonzalo Monroy , Lucy Zhiping Chen , Yue Guo
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/26
- IPC: C23C16/26 ; C23C16/505 ; C23C16/52 ; C23C16/44 ; C23C14/34 ; C23C14/06 ; H01L21/02 ; H01J37/32 ; H01L21/3213 ; H01L21/033 ; H01L21/311

Abstract:
A method of forming a transparent carbon layer on a substrate is provided. The method comprises generating an electron beam plasma above a surface of a substrate positioned over a first electrode and disposed in a processing chamber having a second electrode positioned above the first electrode. The method further comprises flowing a hydrocarbon-containing gas mixture into the processing chamber, wherein the second electrode has a surface containing a secondary electron emission material selected from a silicon-containing material and a carbon-containing material. The method further comprises applying a first RF power to at least one of the first electrode and the second electrode and forming a transparent carbon layer on the surface of the substrate.
Public/Granted literature
- US20190057862A1 PLASMA DEPOSITION OF CARBON HARDMASK Public/Granted day:2019-02-21
Information query
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