Invention Grant
- Patent Title: Semiconductor device and method of forming the same
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Application No.: US17013358Application Date: 2020-09-04
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Publication No.: US11043385B2Publication Date: 2021-06-22
- Inventor: Li-Jung Liu , Chun-Sheng Liang , Shu-Hui Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/285
- IPC: H01L21/285 ; H01L29/49 ; H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/165

Abstract:
A semiconductor device includes a semiconductor fin, a gate structure, a source epitaxy structure and a drain epitaxy structure. The semiconductor fin extends along a first direction above a substrate. The gate structure extends across the semiconductor fin along a second direction different from the first direction. The gate structure includes a gate dielectric layer wrapping around the semiconductor fin and a chlorine-containing N-work function metal layer wrapping around the gate dielectric layer. The source epitaxy structure and the drain epitaxy structure are on opposite sides of the gate structure, respectively.
Information query
IPC分类: