Invention Grant
- Patent Title: Increase the volume of epitaxy regions
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Application No.: US16177889Application Date: 2018-11-01
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Publication No.: US11043424B2Publication Date: 2021-06-22
- Inventor: Yu-Lien Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/762 ; H01L29/66 ; H01L29/78 ; H01L21/02 ; H01L29/08

Abstract:
A method includes forming a gate stack on a plurality of semiconductor fins. The plurality of semiconductor fins includes a plurality of inner fins, and a first outer fin and a second outer fin on opposite sides of the plurality of inner fins. Epitaxy regions are grown based on the plurality of semiconductor fins, and a first height of the epitaxy regions measured along an outer sidewall of the first outer fin is smaller than a second height of the epitaxy regions measured along an inner sidewall of the first outer fin.
Public/Granted literature
- US20200043793A1 Increase the Volume of Epitaxy Regions Public/Granted day:2020-02-06
Information query
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