Invention Grant
- Patent Title: Dummy MOL removal for performance enhancement
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Application No.: US16578357Application Date: 2019-09-22
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Publication No.: US11043426B2Publication Date: 2021-06-22
- Inventor: Hui-Ting Yang , Chih-Ming Lai , Chun-Kuang Chen , Chih-Liang Chen , Charles Chew-Yuen Young , Jiann-Tyng Tzeng , Kam-Tou Sio , Meng-Hung Shen , Ru-Gun Liu , Wei-Cheng Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/02 ; H01L27/088 ; H01L27/092 ; H01L29/423 ; H01L29/78 ; H01L29/49 ; H01L29/66

Abstract:
The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a plurality of gate structures over a substrate, and forming a plurality of source and drain regions along opposing sides of the plurality of gate structures. A plurality of middle-of-the-line (MOL) structures are formed at locations laterally interleaved between the plurality of gate structures. The plurality of MOL structures are redefined by getting rid of a part but not all of one or more of the plurality of MOL structures. Redefining the plurality of MOL structures results in a plurality of MOL active structures arranged over the plurality of source and drain regions at an irregular pitch.
Public/Granted literature
- US20200020588A1 DUMMY MOL REMOVAL FOR PERFORMANCE ENHANCEMENT Public/Granted day:2020-01-16
Information query
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