Apparatus and methods are provided for bond bads layout and structure of semiconductor dies. According to various aspects of the subject innovation, the provided techniques may provide a semiconductor die that may comprise an outer bond pad elongated in a first direction parallel to an edge of the semiconductor die and an inner bond pad elongated in a second direction perpendicular to the edge of the semiconductor die. The outer bond pad may have a probing area and two wire bond areas aligned in the first direction and the inner bond pad may have one probing area and one wire bond area aligned in the second direction. The outer bond pad may be positioned closer to the edge of the semiconductor die than the inner bond pad.