Invention Grant
- Patent Title: Device-bonded body, image pickup module, endoscope and method for manufacturing device-bonded body
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Application No.: US16411693Application Date: 2019-05-14
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Publication No.: US11043524B2Publication Date: 2021-06-22
- Inventor: Takashi Nakayama
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L27/146 ; A61B1/00 ; A61B1/05 ; H01L23/00
Abstract:
A device-bonded body includes: a first device where a plated bump is disposed; a second device where a bonding electrode bonded to the plated bump is disposed; and a sealing layer made of NCF or NCP, the sealing layer being disposed between the first device and the second device and including filler particles made of inorganic material; wherein a surface of the plated bump includes a first area and a second area higher than the first area; and at least a part of a side surface of an outer circumferential portion of the second area intersects with a surface of the first area.
Public/Granted literature
- US20190273110A1 DEVICE-BONDED BODY, IMAGE PICKUP MODULE, ENDOSCOPE AND METHOD FOR MANUFACTURING DEVICE-BONDED BODY Public/Granted day:2019-09-05
Information query
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