Invention Grant
- Patent Title: Semiconductor structure and manufacturing method of the same
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Application No.: US16689918Application Date: 2019-11-20
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Publication No.: US11043531B2Publication Date: 2021-06-22
- Inventor: Alexander Kalnitsky , Sheng-Huang Huang , Harry-Hak-Lay Chuang , Jiunyu Tsai , Hung Cho Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/22 ; H01L43/02 ; H01F10/32 ; H01F41/34 ; G11C11/16 ; H01L43/12

Abstract:
The present disclosure provides a semiconductor structure having a memory region. The semiconductor structure includes an Nth metal layer in a memory region and a periphery region, the periphery region spanning a wider area than the memory region, a plurality of magnetic tunneling junctions (MTJs) over the Nth metal layer, the plurality of MTJs having at least one of mixed pitches and mixed sizes, a top electrode via over each of the plurality of MTJs; and an (N+M)th metal layer over the plurality of MTJs. A method for manufacturing the semiconductor structure is also disclosed.
Public/Granted literature
- US20200091230A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2020-03-19
Information query
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