Invention Grant
- Patent Title: FinFET device and method
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Application No.: US16549046Application Date: 2019-08-23
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Publication No.: US11043576B2Publication Date: 2021-06-22
- Inventor: Chih-Han Lin , Ming-Ching Chang , Chao-Cheng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/417 ; H01L29/423

Abstract:
A semiconductor device includes a fin extending from a substrate, a gate stack over and along a sidewall of the fin, a spacer along a first sidewall of the gate stack and the sidewall of the fin, a dummy gate material along the sidewall of the fin, wherein the dummy gate material is between the spacer and the gate stack, and a first epitaxial source/drain region in the fin and adjacent the gate stack.
Public/Granted literature
- US20210057545A1 FinFET Device and Method Public/Granted day:2021-02-25
Information query
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