Invention Grant
- Patent Title: Light emitting diode and method of manufacturing the same
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Application No.: US16583773Application Date: 2019-09-26
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Publication No.: US11043609B2Publication Date: 2021-06-22
- Inventor: Senlin Li , Jingfeng Bi , Chun-Kai Huang , Jin Wang , Chih-Hung Hsiao , Chun-I Wu , Du-Xiang Wang
- Applicant: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Current Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Thomas | Horstemeyer
- Priority: CN201710637778.7 20170731
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/50 ; H01L33/26

Abstract:
A light emitting diode includes an n-type confinement layer, a quantum well active layer formed on the n-type confinement layer, a p-type confinement layer formed on the quantum well active layer, a gallium phosphide-based quantum dot structure formed in the p-type confinement layer, and a GaP-based current spreading layer formed on the GaP-based quantum dot structure. A method of manufacturing the light emitting diode is also provided.
Public/Granted literature
- US20200020826A1 LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-01-16
Information query
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