Invention Grant
- Patent Title: Enhanced antenna module with shield layer
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Application No.: US16411883Application Date: 2019-05-14
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Publication No.: US11043740B2Publication Date: 2021-06-22
- Inventor: Suhyung Hwang , Chin-Kwan Kim , Hong Bok We , Jaehyun Yeon
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Withrow & Terranova, PLLC
- Main IPC: H01Q1/52
- IPC: H01Q1/52

Abstract:
Methods and apparatuses for enhancing antenna modules with a shield layer. The apparatus includes an antenna module having an antenna layer. The antenna layer includes an antenna. The antenna module further includes a signal routing layer; a radio frequency (RF) communication component disposed on the signal routing layer; a shield cover encasing the RF communication component; and a shield layer. The antenna module further includes an antenna module side. The antenna module side includes a side of the signal routing layer and a side of the antenna layer. The shield layer covers a portion of the antenna module side such that at least a portion of the side of the antenna layer is uncovered.
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