Invention Grant
- Patent Title: Terminal-equipped electric wire manufacturing apparatus and terminal-equipped electric wire
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Application No.: US16817052Application Date: 2020-03-12
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Publication No.: US11043779B2Publication Date: 2021-06-22
- Inventor: Hirotaka Takeda , Kei Sato
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JPJP2019-077669 20190416
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H01R4/18 ; H01R43/048 ; H01R4/70

Abstract:
A terminal-equipped electric wire manufacturing apparatus, includes: a placing table on which a crimp terminal is placed while kept crimped to an electric wire; and a supply device that supplies an anticorrosive material to the crimp terminal placed on the placing table while kept crimped to the electric wire. While kept crimped to the electric wire, the crimp terminal has a communication hole allowing communication between a gap space portion in the crimp terminal and outside of the crimp terminal gap space portion. The placing table has a distribution hole positioned opposite the communication hole of the placed crimp terminal, the distribution hole allowing the anticorrosive material, supplied from the supply device, to flow in the distribution hole.
Public/Granted literature
- US11133634B2 Terminal-equipped electric wire manufacturing apparatus and terminal-equipped electric wire Public/Granted day:2021-09-28
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