Invention Grant
- Patent Title: High-frequency module and communication device
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Application No.: US17152108Application Date: 2021-01-19
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Publication No.: US11043925B2Publication Date: 2021-06-22
- Inventor: Terumichi Kita
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-050494 20170315
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H03H7/38 ; H03F3/195 ; H03H7/46 ; H03H9/72 ; H03F1/26

Abstract:
A radio frequency module includes a substrate having first and second main surfaces; a first filter; third and fourth switches connected to the filter; an amplifier; and/or a matching circuit element connected to the first filter. In various embodiments, the matching circuit element may be on the first main surface while the amplifier may be on the second main surface; the matching circuit element may be on the first main surface while the third switch may be on the second main surface; and/or the filter may be on the first main surface while the fourth switch may be on the second main surface.
Public/Granted literature
- US20210143780A1 HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-05-13
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