A base member with wiring and a microphone are provided. In the base member with wiring, an insulation adhesive layer, which is elastically deformable, is provided on one surface of a film, which has flexibility, and a conductor pattern is formed on the insulation adhesive layer. The microphone is mounted on the base member with wiring. A terminal of the microphone is in touch with the conductor pattern in face-to-face manner, and a part, on which the terminal is not formed, of a surface of the microphone and a part, on which the conductor pattern is not formed, of a surface of the insulation adhesive layer are bonded and mechanically coupled with each other.