Invention Grant
- Patent Title: Header compression handling during handover
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Application No.: US16808091Application Date: 2020-03-03
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Publication No.: US11044632B2Publication Date: 2021-06-22
- Inventor: Karthika Paladugu , Sitaramanjaneyulu Kanamarlapudi , Ozcan Ozturk , Prasad Reddy Kadiri
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: H04W28/06
- IPC: H04W28/06 ; H04W76/15 ; H04W36/00

Abstract:
Aspects of the present disclosure relate to wireless communications, and more particularly, handling header compression in scenarios with concurrent connections, such as make-before-break (MBB) handover or dual connectivity (DC) scenarios. A method of wireless communication performed by a user equipment (UE) can include concurrently communicating with a first base station (BS) on a connection with the first BS and with a second BS on a connection with the second BS during a handover procedure. The UE maintains a context for a header compression protocol for the connection with the first BS and the connection with the second BS. The concurrently communicating includes using the header compression protocol context for sending one or more packets, receiving one or more packets, or both.
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