Invention Grant
- Patent Title: Method of assembly
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Application No.: US16309955Application Date: 2016-06-21
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Publication No.: US11044814B2Publication Date: 2021-06-22
- Inventor: Koenraad Alexander Gieskes
- Applicant: Universal Instruments Corporation
- Applicant Address: US NY Conklin
- Assignee: Universal Instruments Corporation
- Current Assignee: Universal Instruments Corporation
- Current Assignee Address: US NY Conklin
- Agency: Schmeiser, Olsen & Watts, LLP
- International Application: PCT/US2016/038455 WO 20160621
- International Announcement: WO2017/222502 WO 20171228
- Main IPC: H01S4/00
- IPC: H01S4/00 ; H05K1/18 ; H05K13/04 ; H05K1/11

Abstract:
A slip track includes a continuous circuitous track. The continuous circuitous track includes a layered printed circuit board. The layered printed circuit board includes a top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer. The layered printed circuit board is flexible and is bent around curves in the continuous circuitous track. A method of assembly using the slip track is further disclosed.
Public/Granted literature
- US20190166697A1 SLIPTRACK ARCHITECTURE FOR AN ASSEMBLY MACHINE, SYSTEM AND METHOD Public/Granted day:2019-05-30
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