A burr-suppressing copper foil is described. In an embodiment, the burr-suppressing copper foil includes a poly-based film having an adhesive on a first side and an adhesive on a second side. A copper foil contacts the adhesive at the first side of the poly-based film to removably couple the poly-based film to the copper foil. A metallic burr suppressor contacts the adhesive on the second side to removably couple the poly-based film to the metallic burr suppressor.