Invention Grant
- Patent Title: Thermally conductive board
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Application No.: US16844566Application Date: 2020-04-09
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Publication No.: US11044817B2Publication Date: 2021-06-22
- Inventor: Kuo-Hsun Chen , Chia-Hsiung Wu , Kai-Wei Lo , Yu-Hsuan Tseng
- Applicant: Polytronics Technology Corp.
- Applicant Address: TW Hsinchu
- Assignee: Polytronics Technology Corp.
- Current Assignee: Polytronics Technology Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW108130094 20190822
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K1/11 ; H05K3/00 ; H05K3/02 ; H05K3/06 ; H05K3/10 ; H05K3/20 ; H05K3/38 ; H05K3/46 ; H01M4/04 ; H01M4/48 ; H01M4/50 ; H01M4/52 ; H01M4/54 ; H01M4/58 ; H01M4/62 ; H01M4/66 ; H01M4/485 ; H05K3/26

Abstract:
A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and −1V. The microrough surface has a roughness Rz of 2-18 μm.
Public/Granted literature
- US20210059056A1 THERMALLY CONDUCTIVE BOARD Public/Granted day:2021-02-25
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